Surface mounted electrical components

ABSTRACT

Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

FIELD OF THE INVENTION

The present invention relates to surface mounted electrical componentshaving improved retentive properties, and methods for mounting andretaining electrical components on substrates.

BACKGROUND OF THE INVENTION

Various methods of electrically connecting components such as connectorsand integrated circuit devices to printed boards are well known in theart. Surface mount technology is increasingly being employed ascost-effective method. Examples of surface mount technology include pingrid arrays (PGA's), ball grid arrays (BGA's), column grid arrays(CGA's), and land grid array (LGA's). Generally with such methods, asolder paste is introduced between surfaces to be joined, the solderpaste reflowed, and then cooled to form a mechanical and electricallyconductive joint.

As the name implies, ball grid arrays (BGA's) utilize a grid or array ofsolder bumps or balls arranged on one side of an electrical component toeffectuate electrical and mechanical connection with a printed board.The ball attachment sites are typically referred to as lands or pads.Solder past is disposed on the lands (and/or on the balls), such asthrough screening or masking techniques, and the electrical component isthen positioned on the board so that the balls and lands are registered.The board is then processed at an elevated temperature sufficient tocause the solder and at least a portion or all of the solder ball toflow and fuse with the underlying land/pad to form the electricalinterconnection. See, for example, U.S. Pat. No. 6,325,644 assigned tothe assignee of this patent, and patents within that patent, all ofwhich is incorporated by reference herein.

Locator pins extending from the electrical component may be employed tofacilitate the initial alignment of the electrical component. Thelocator pins are inserted into through holes located in the board atlocations along the periphery of the array of lands/pads. Pin diametersmay be slightly larger than the corresponding through hole diameters sothat an interference fit is achieved. Alternatively, the pin diametersmay be smaller than the through hole diameters. In this scenario,adhesive or solder paste may be applied in and around the through holesto help retain the electrical component on the substrate.

By selecting locator pins with a relatively smaller diameter andapplying solder within the through holes, the BGA balls are allowed tofloat(that is, not rigidly restricted) during a reflow process resultingin self-alignment and ultimately a low stress solder joint. Componentretention however may be compromised with this configuration when theboard is manipulated before the reflow heat is substantially dissipated,or when the board is rotated so that additional electrical componentscan be mounted on other available surface areas with subsequent reflowsteps.

Accordingly, there is a need for a method of mounting electricalcomponents on a substrate that provides for a low stress solder jointwhile effectively retaining the mounted components during ensuingdouble-sided handling and/or processing during a second reflow step.

SUMMARY OF THE INVENTION

Methods for mounting electrical components on substrates are provided bythe present invention. In accordance with a first preferred embodimentof the present invention, there has now been provided a method formounting and retaining an electrical component on a substrate that issubjected to at least two thermal cycles. The method comprises the stepsof: disposing solder paste of a first solder composition into aretentive through hole of the substrate; inserting a retentive pinextending from the electrical component and having a relatively smallerdiameter into the retentive through hole; subjecting the substrate to afirst thermal cycle such that material associated with at least one ofthe retentive through hole and retentive pin migrates into the solderpaste to create a mixed solder composition that has a higher meltingpoint than the first solder composition; and then subjecting thesubstrate to a second thermal cycle having a peak temperature less thanthe melting point of said mixed solder composition.

In accordance with another preferred embodiment of the presentinvention, there has now been provided a method for making an electronicassembly. The method comprises the steps of: providing a circuit boardincluding a retentive through hole having a wall; providing anelectrical connector having a retentive pin extending therefrom, whereinthe retentive pin has a diameter smaller than the retentive through holeand is made from a material comprising a precious metal; disposingsolder paste of a first solder composition into the retentive throughhole; inserting the retentive pin into the retentive through hole; andreflowing the solder paste such that at least some of the precious metaloriginally associated with the retentive pin migrates into the solderpaste to create a mixed solder composition.

In accordance with yet another preferred embodiment of the presentinvention, there has now been provided a method for mounting electricalcomponents on opposing sides of a substrate. The method comprises thesteps of: providing a substrate including first and second sides andfirst and second retentive through holes; providing a first electricalcomponent including a first retentive pin extending therefrom, whereinthe first retentive pin has a diameter smaller than that of the firstretentive through hole, and has plating material thereon; disposingsolder paste of a first solder composition into said first retentivethrough hole; juxtaposing the first electrical component on the firstside of the substrate, and inserting the first retentive pin into thefirst retentive through hole; heating the substrate such that at least aportion of the plating material migrates from the first retentive pininto the solder paste, wherein a mixed solder composition is createdwhich has a higher melting point than that of said first soldercomposition; disposing solder paste of the first solder composition intothe second retentive through hole; providing a second electricalcomponent including a second retentive pin extending therefrom, whereinthe second retentive pin has a diameter smaller than that of the secondretentive through hole; juxtaposing the second electrical component onthe second side of the substrate, and inserting the second retentive pininto the second retentive through hole; and heating the substrate to atemperature sufficient to reflow the first solder composition and belowthe melting point of the mixed solder composition.

Electronic assemblies are also provided by the present invention. Inaccordance with a preferred embodiment of the present invention, therehas now been provided an electronic assembly comprising a circuit boardincluding a retentive through hole having a wall; an electricalcomponent including a housing and retentive pin extending therefrommounted on the circuit board, wherein the retentive pin is disposedwithin said retentive through hole and has a diameter less than that ofthe retentive through hole; and reflowed solder disposed in theretentive through hole and surrounding at least a portion of theretentive pin, wherein the reflowed solder includes material originallyassociated with at least one of the retentive pin and the retentivethrough hole wall, and wherein the reflowed solder has a melting pointgreater than a melting point of pure solder.

In accordance with another preferred embodiment of the presentinvention, there has now been provided an electronic assembly comprisinga circuit board including a retentive through hole; an electricalcomponent including a housing and retentive pin extending therefrommounted on the circuit board, wherein the retentive pin is disposedwithin the retentive through hole and has a diameter less than that ofthe retentive through hole; and reflowed solder disposed in theretentive through hole and surrounding the retentive pin, wherein atleast about 0.5% by weight of said reflowed solder is an additivecomprising a precious metal.

In accordance with yet another preferred embodiment of the presentinvention, there has now been provided an electronic assembly comprisinga circuit board including a retentive through hole; an electricalcomponent including a housing and retentive pin extending therefrommounted on the circuit board, wherein the retentive pin is disposedwithin the retentive through hole, has a diameter less than that of theretentive through hole, and has plating material thereon; and reflowedsolder disposed in the retentive through hole and surrounding theretentive pin, wherein the reflowed solder comprises at least about 0.5%by weight of the plating material that has migrated from the retentivepin.

These and various other features of novelty, and their respectiveadvantages, are pointed out with particularity in the claims annexedhereto and forming a part hereof. However, for a better understanding ofaspects of the invention, reference should be made to the drawings whichform a further part hereof, and to the accompanying descriptive matter,in which there is illustrated preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an electronic component designed andconfigured for surface mounting to a substrate.

FIG. 2 is a plan view of a circuit board including surface mountinglands.

FIG. 3 is a partial side view of an electronic assembly embodimentprovided by the present invention showing an electronic connectormounted to a circuit board including ball grid array interconnections

FIG. 4 is a partial perspective view of an electronic assemblyembodiment provided by the present invention showing an electronicconnector mounted to a circuit board including ball grid arrayinterconnections and retentive pins disposed in solder-filled throughholes.

FIG. 5 is a partial cross-sectional view of an electronic componentretentive pin disposed in a substrate retentive through hole with soldersurrounding the retentive pin.

FIG. 6 is a partial perspective view of an electronic assemblyembodiment provided by the present invention including electroniccomponents surface mounted to both sides of a circuit board.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention are directed to surfacemounted electrical components having improved retentive properties andmethods for making the same. Referring now to the drawings, wherein likereference numerals designate corresponding structure throughout theviews, and referring in particular to FIG. 1, an electrical component 10in the form of a connector is shown including housing 20, an array ofsolder balls 21 extending from a housing lower surface 22, and retentivepins 25 extending from housing lower surface 22 and spaced apart fromsolder balls 21. Each of solder balls 21 is coupled to an end of one ofa plurality of conventional terminals (not shown) that reside withinhousing 20. Opposing ends of the terminals can be engaged by anelectrical component, such as, for example, an integrated chip or matingelectrical connector.

Electrical connector 10 is suitable for surface mounting to a substrate,such as the printed circuit board 40 shown in FIG. 2. Printed circuitboard 40 includes a first side 42, an array of lands or pads 41 disposedon side 42 that correspond to the array of solder balls 21, andretentive through holes 45 that are designed and configured to acceptretentive pins 25.

Referring to FIGS. 3 and 4, to mount electrical connector 10 to circuitboard 40, solder paste 50 is first applied to lands or pads 41, and inand/or around retentive through holes 45. Numerous techniques readilyunderstood by one skilled in the art, such as, for examplescreen-printing, screening or masking, may be used to apply the solderpaste. Solder paste 50 is preferably a eutectic alloy of tin and leadhaving a melting point of approximately 183 degrees Celsius. Electricalconnector 10 is placed in juxtaposition with board 40, with individualsolder balls 21 roughly aligned with corresponding individual lands orpads 41 by inserting retentive pins 25 into the solder containingretentive through holes 45. The board/component assembly is thenreflowed (subjected to a thermal cycle) preferably in a stationary orbelt type furnace that employs convection or radiation heat sources. Thesolder reflow may be performed in an environment selected from a groupcomprising dry nitrogen, forming gas or hydrogen. The reflow processtypically includes a thermal cycle that subjects the board-componentassembly to a peak temperature (or temperature at or above the meltingpoint of the solder paste) for a time period between 15 and 150 seconds.The reflow process is conventional and well documented in theliterature.

Referring now to FIG. 5, retentive pins 25 preferably have a diameter 26that is smaller than the diameter 46 of the retentive through holes,such that the component being surface mounted to the board is allowed tofloat. For example, the pin diameters 26 may be approximately 0.9 mm andthe corresponding through hole diameters 46 approximately 1.1 mm;although the specific diameters and difference between the two diametersmay be greater or smaller than this. This configuration promotesself-aligning of balls 21 with lands 41, and results in a low stresssolder joint.

After mounting the electrical connector 10 to board 40 (as can be seenin FIG. 2), it may be desirable to further process the board/componentassembly at temperatures above the melting point of solder paste 50without affecting solder bonds previously formed. The present inventionprovides method embodiments to improve the retention of mountedelectrical components employing retentive pins having diameters lessthan the through hole diameters, by altering the solder compositionwithin the retentive through holes 45 during or after the initialcomponent mounting. To alter the solder composition, retentive pins 25are plated with materials including precious metals such as gold,palladium, platinum, silver, rhodium, iridium, osmium, ruthenium, andrhenium. During the first reflow (or shortly thereafter), at least aportion of the precious plating material migrates from retentive pins 25and into solder paste 50 residing within retentive through holes 45,thereby creating a mixed solder composition that includes an additivemade up of the plating material. Due to the presence of the additive,the melting point of the mixed solder composition is higher than themelting point of the original solder composition (i.e., melting point ofpure solder). The melting point of the mixed solder composition shouldnow preferably be at least 10 degrees Celsius higher than the meltingpoint of the original (or first) composition. Accordingly, the boardassembly may be further processed to a temperature at or above themelting point of the first solder composition and below the meltingpoint of the mixed solder composition without concern that the mountedelectrical component will become separated from the board.

In alternative embodiments, a wall 47 (see FIG. 5) of retentive throughholes 45 may be plated with material that will migrate into the solderpaste during or after an initial reflow process. Or both the throughhole walls 47 and the retentive pins 25 may be plated with similar ordissimilar materials for migration into the solder paste. The migratedmaterial may also originate from a base composition of the retentivepins and through hole walls, rather than from plating material overlyinga similar base composition. Preferably, retentive pins 25 are the solesource of the migrating material. In preferred embodiments, retentivepins 25 are made from a lead-brass alloy base material, with a firstplating layer of nickel at a thickness of from about 0.00127 to about0.00635 mm, and a second plating layer of gold or palladium at a similarthickness.

One instance where two or more reflow steps (two thermal cycles) mayoccur is when electrical components are mounted on both sides 42 and 43of circuit board 40. A preferred method embodiment for mountingelectrical components on opposing sides of a circuit board begins with astep of applying solder paste 50 to lands 41 and in and around retentivethrough holes 45 on side 42 of board 40. The solder composition at thispoint preferably consists essentially of tin and lead. Referring againto FIG. 4, first electrical component 10 is movably coupled to side 42by inserting retentive pins 25 comprising a gold or palladium platinginto the solder containing through holes 45. Board 40 is then subjectedto a first thermal cycle including a peak temperature of about 183degrees Celsius to reflow solder paste 50. During the first thermalcycle, at least a portion of the gold or palladium plating migrates fromretentive pins 25 and into solder paste 50 residing within through holes45. The solder composition within through holes 45 now comprises tin,lead, and gold or palladium, and has a melting point higher than 183degrees Celsius. The amount of gold or palladium present in the reflowedsolder will typically vary, with higher concentrations proximateretentive pins 25. In preferred embodiments, the gold or palladium (orother plating material) is present in the reflowed solder in an amountof at least about 0.5% by weight.

Referring now to FIG. 6, board 40 is flipped and side 43 is prepared formounting a second electrical component thereon. The same solder paste 50composition (consisting essential of tin and lead) used for mounting theelectrical component 10 on board side 42 is now applied to lands 141 andin and around retentive holes 145 located on board side 43. A secondelectrical component 110 (similar or dissimilar to component 10)comprising an array of solder balls 121 and retentive pins 125 ismovably coupled to board 40 in a similar fashion to that of component10. Board 40 is subjected to a second thermal cycle including a peaktemperature of about 183 degrees Celsius to reflow solder paste 50.During the second thermal cycle, reflowed solder in retentive throughholes 45 does not melt, and therefore, first electrical component 10 issecurely held on board 40. Retentive pins on the second electricalcomponent 110 may or may not include materials that will migrate intothe solder paste residing in retentive though holes 145. A cost savings,via materials and processing, may be realized by not including a platingmaterial on the retentive pins (or on the walls of through holes 145)extending from electrical component 110. Obviously, if retentive pins onelectrical component 110 are made with a material comprising a preciousmetal, then migration will likely occur during the second thermal cycle.

EXAMPLES Example 1

Table 1 includes parameters of two preferred embodiments along with thecalculated solder compositional change after a first thermal cycle.

TABLE 1 Gold Plating Palladium Plating Unplated pin diameter, mm 0.900.90 Plating thickness, mm 0.0051 0.0051 Through hole diameter, mm 1.101.10 Solder volume, mm³ 0.57 0.57 Migration, % volume 60 40 Migratedmaterial in reflowed solder, % 6.10 4.20 volume Original solder meltingpoint, ° Celsius 183 183 Altered solder melting point, ° Celsius 226 235

Example 2

Un-plated retentive pins having a diameter of 0.90 mm were plated withgold or palladium at a thickness of approximately 0.0051 mm. A eutectictin-lead solder paste was applied in and around retentive holesextending through a board. The retentive through holes had a diameter of1.10 mm. The plated retentive pins were inserted into the retentivethrough holes and the board subjected to a thermal cycle sufficient toreflow the solder paste. Samples of the altered solder were taken atthree positions, as shown in FIG. 5: 1) proximate the retentive pin—P1;2) proximate the wall of the retentive through hole—P3; and 3) anintermediate position—P2. The solder samples were analyzed via massspectrometry. Table 2 shows the amount of plating material (% by weight)present in the solder after completing the thermal cycle.

TABLE 2 Plating Material in Pin Plating Material Solder Sample PositionSolder, % by weight Gold P1 14.88 Gold P2 5.84 Gold P3 4.58 Palladium P119.62 Palladium P2 6.05 Palladium P3 1.78

As can be seen in Table 2, the plating material diffuses all the waythrough the solder disposed within the retentive through holes. That is,the plating material presence in the solder is not isolated to thesolder region nearest to the material source (retentive pin). Inaddition, Table 2 illustrates that gold diffuses more effectively thanpalladium through the tin-lead solder once the material is leached offof the retentive pins.

It is to be understood that even though numerous characteristics andadvantages of the present invention have been set forth in the foregoingdescription, together with details of the structure, manufacture of, andfunction of the invention, the disclosure is illustrative only.Accordingly, changes may be made in detail, especially in matters ofshape, size and arrangement of structural features, as well as,sequences of manufacturing steps, within the principles of the inventionto the full extent indicated by the broad general meaning of the termsin which the appended claims are expressed.

What is claimed is:
 1. An electronic assembly comprising: a circuitsubstrate including a retentive through hole having a wall; anelectrical component including a housing and retentive pin extendingtherefrom mounted on said circuit substrate, wherein said retentive pinis disposed within said retentive through hole and has a diameter lessthan that of said retentive through hole; and a mixed solder compositiondisposed in said retentive through hole and surrounding at least aportion of said retentive pin, said mixed solder composition includingmaterial originally associated with at least one of said retentive pinand said retentive through hole wall that migrated during a reflowprocess into a first solder composition disposed in said retentivethrough hole, wherein the mixed solder composition has a melting pointgreater than a melting point of said first solder composition.
 2. Theelectronic assembly of claim 1, wherein the melting point of said mixedsolder composition is greater than the melting point of said firstsolder composition by about 10 degrees Celsius.
 3. The electronicassembly of claim 1, wherein said mixed solder composition at locationsproximate said retentive pin includes at least about 10% by weight ofthe material originally associated with at least one of said retentivepin and said retentive through hole wall.
 4. The electronic assembly ofclaim 1, wherein said mixed solder composition at locations proximatesaid through hole wall includes at least about 0.5% by weight ofmaterial originally associated with at least one of said retentive pinand said retentive through hole wall.
 5. The electronic assembly ofclaim 1, wherein the material originally associated with at least one ofsaid retentive pm and said retentive through hole wall was originallyassociated solely with said retentive pin.
 6. The electronic assembly ofclaim 1, wherein the material originally associated with at least one ofsaid retentive pin and said retentive through hole wall was originallyassociated with said through hole wall.
 7. An electronic assemblycomprising: a circuit board including a retentive through hole; anelectrical component including a housing and retentive pin extendingtherefrom mounted on said circuit board, wherein said retentive pin isdisposed within said retentive through hole and has a diameter less thanthat of said retentive through hole; and reflowed solder disposed insaid retentive through hole and surrounding said retentive pin, whereinat least about 0.5% by weight of said reflowed solder is an additivecomprising a precious metal.
 8. The electronic assembly of claim 7,wherein said precious metal is gold.
 9. The electronic assembly of claim7, wherein said precious metal is palladium.
 10. An electronic assemblycomprising: a circuit substrate including a retentive through hole; anelectrical component including a housing and retentive pin extendingtherefrom mounted on said circuit substrate, wherein said retentive pinis disposed within said retentive through hole, has a diameter less thanthat of said retentive through hole, and has plating material thereon;and a mixed solder composition disposed in said retentive through holeand surrounding said retentive pin, wherein said mixed soldercomposition comprises at least about 0.5% by weight of said platingmaterial that has migrated from said retentive pin during a reflowprocess into a first solder composition disposed in said retentivethrough hole which comprised less than about 0.5% by weight of saidplating material.
 11. An electronic assembly comprising: a circuitsubstrate including a retentive hole; an electrical component mounted onsaid circuit substrate, said electrical component including a housingand a retentive structure extending therefrom, said retentive structureis disposed within said retentive hole; and a mixed solder compositiondisposed in said retentive hole and surrounding said retentivestructure, wherein said mixed solder composition comprises at leastabout 0.5% by weight of plating material that has migrated from at leastone of said retentive hole and said retentive structure during a reflowprocess into a first solder composition disposed in said retentivethrough hole which comprised less than about 0.5% by weight of saidplating material.
 12. An electrical connector, comprising: a housing; aplurality of solder masses extending from a surface of said housing; andat least one retentive structure for engaging a circuit substrate, saidat least one retentive structure extending from said surface of saidhousing and being spaced apart from each of said plurality of solderballs, and being plated with a material selected from the groupconsisting of gold, palladium, platinum, silver, rhodium, iridium,osmium, ruthenium, and rhenium.
 13. The electrical connector of claim12, wherein the at least one retentive structure is plated with gold.14. The electrical connector of claim 12, wherein the at lest oneretentive structure is plated with palladium.